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ERS introduces cutting-edge innovation in semiconductor thermal testing

Munich, November 14, 2017 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness.


The new AirCool PRIME family of thermal chucks, developed in close cooperation with MPI
Corporation, offers unsurpassed flexibility and the industry’s fastest transition times. With this
achievement, the system greatly increases the customer’s test throughput. Likewise, the system
features the largest variety of thermal ranges on the market, offering the unmatched flexibility over
a wide range of semiconductor test applications. Available initially for 300mm (12”) wafers, the ERS AirCool PRIME incorporates a flexible and modular top plate design concept allowing easy field upgradeability. 


Through the integration of the PRIME™ Thermo Shield (PTS) into the chuck, the AirCool PRIME products drastically shorten the soaking times within the test cycle. Thus, the system achieves Instantly-Ready-For-Test IRFT capability. It creates a mini-environment around the chuck which results in fast and accurate tests. Its ultra-low signal noise in the single-digit Femto-Ampere (fA) range allows extreme sensitive measurement.In order to tailor the system’s thermal capability to the customer’s requirements and budget, the system can be configured for a variety of temperature ranges between -60°C and +300°C. Through ERS’ Super Booster technology, test temperatures down to -10°C can be achieved without a separate chiller. For lower test temperatures, down to -40°C, ERS is offering a compact chiller which occupies only one third of the footprint of comparable systems.

“Co-developing the Air Cool PRIME technology with ERS Electronic has enabled significant
advancements in feature sets that enable mutual customers to become much more effective and
efficient in thermal wafer probing applications,” says Stojan Kanev, General Manager of MPI
Corporation’s Advanced Semiconductor Division. “Combining the talent of our organizations has
once again proven highly successful in terms of providing powerful, customer oriented solutions.
Reductions in equipment footprint size and significantly reduced CDA consumption are two critical
cost savings the AirCool PRIME Technology provides yet it is the optimized thermal management,
quick set-up, distinguished electrical performance and enhanced throughput that are absolute game
changers.”


“We were very pleased with the cooperation with MPI which has given us valuable insights and
expertise in the challenging analytical wafer probing market” comments Klemens Reitinger, CEO of
ERS electronic GmbH. “Today's semiconductor market with megatrends like IoT, electromobility and
renewable energies, places extreme requirements on chips in terms of high-frequency and high
voltage technology. It is precisely the customers focusing on these application fields that will benefit
most from our new innovations. For example, AirCool PRIME enables fast and thorough testing of
power semiconductors for voltages up to 12kV”, explains Reitinger. “MPI´s experience in the highly
challenging RF Probing helped us include innovative features for testing High Speed and RF circuits
for the IoT market”, he adds.


Press contact:
Sophia Oldeide
PR and MarCom
oldeide@ers-gmbh.de
+47 47332776


ERS electronic will showcase manufacturing innovation at Semicon Europa

Munich, 2nd November, 2017 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world's leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous European customers, this represents an excellent opportunity to receive an update on the company’s innovation in terms of products and technology.

ERS has a solid and growing installed base among Europe’s highly advanced semiconductor manufacturers and research institutions. While today more than 50 per cent of ERS shipments are made to customers in Asia, Europe and its semiconductor industry remain essential for innovation and product development. ERS runs a support centre in Europe’s semiconductor manufacturing stronghold, Dresden. In addition, the company has established an eWLB (advanced Wafer Level Packaging) competence centre in Munich to address the fast growing FOWLP (Fan Out Wafer Level Packaging) markets in the semiconductor value chain backend. Through these activities, ERS maintains a close working relationship with its customers, including multiple key players in semiconductor testing. “The trust that our customers place in us gives us great momentum in the market. Our presence at the Semicon Europa will give us the opportunity to engage with our customers, share first-hand information about our new products and developments and give them a chance to discuss their needs with us”, says Laurent Giai-Miniet, CSMO of ERS electronic GmbH.

Yole Développement (Yole) confirms the impressive penetration of FOWLP in the advanced packaging industry: “Driven by numerous added values, including good electrical performance, high integration capability and small form factor for limited cost, the market doubled between 2015 and 2017 with Apple choosing TSMC’s FOWLP for their application processor”, explains Jérôme Azémar, Activity Developer, Advanced Packaging & Semiconductor Manufacturing at Yole. “This trend will keep going with a 20% CAGR(1)  from 2017 to 2022, thanks to other major players adopting FOWLP, explains the strategy consulting & market research company(2).”

At Semicon Europa, ERS will once again be demonstrating its innovation strength. “We will be releasing a complete new family of chucks, developed in cooperation with an industry leader”, explains Laurent Giai-Miniet. “This is the 4th generation of innovation in thermal chucks”.
“In the long run, we expect that our FOWLP activity will be as big as our thermal chuck business” Giai-Miniet adds.

Cost efficiency and accuracy in testing

All sub-markets and applications of semiconductor technology are characterized by rapid technological progress. Each new generation of chips features smaller geometries, higher operating frequencies and lower energy consumption. This progress can only be achieved if the semiconductors are subjected to ever more rigorous tests during the course of their production. These tests in turn enable an increased level of accuracy, repeatability, flexibility and cost-effectiveness for the test procedures. The test equipment from ERS electronic meets these requirements thanks to the outstanding expertise of its developers and their proverbial quality awareness. ERS’ development and production of AirCool systems takes place exclusively in Germany. The level of quality, together with the advanced design of ERS products, has allowed ERS to gain market share. In 2016 and 2017 alone, revenue generated from thermal chucks increased 33 per cent.


Press contact:

Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776

(1) CAGR : Compound Annual Growth Rate
(2) Source : Fan-Out: Technologies and Market trends report, Yole Développement, 2017
https://www.i-micronews.com/advanced-packaging-report/product/fan-out-technologies-and-market-trends-2017.html


 
 

Further news

  • 18.07.2017: ERS appoints seasoned expert to fill new CSMO position

    Industry Exhibitions and Conferences

    ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.

     

     
 
 

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