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News at ERS

ERS electronic is announcing Woowon Technology Co., Ltd. as new sales channel partner

MUNICH, JULY 9th, 2018 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Korean company Woowon Technology Co., Ltd. to their list of distributors in Asia. Woowon will, as of July, be in charge of sales and distribution of ERS’ products in Korea. Woowon has, since its establishment in 1990, facilitated the growth of more than 30 major foreign manufacturers from its headquarters in Kyeonggi-do, Korea.
“We believe it’s the perfect time to add a channel partner in the region and expand our footprint in Asia” says Laurent Giai-Miniet, CSMO and CEO. “Korea is one of the largest semiconductor equipment markets at the moment, and we expect it to grow even more. We are already seeing an increase in demand of tri-temperature wafer testing for Memory production, as well as for eWLB and FOWLP manufacturing equipment for advanced packaging. Expanding our business in Korea after having started our Chinese operation is critical for ERS growth.”
“Woowon Technology is proud to be associated with ERS, and to add Thermal Wafer Test and Wafer Debonding Technology to the portfolio of industry leading companies we represent. We are delighted to be offering ERS’ thermal chucks and automatic debonding solutions in Korea”, commented Dr. Hwan Oh, Founder and President of Woowon Technology.

Press contact:

Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776

ERS welcomes Regine Beckmann as new Channel Marketing and Internal Sales manager

MUNICH, JULY 2nd 2018 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is proud to announce that Regine Beckmann will, as of July, work as their new Channel Marketing and Internal Sales manager. Beckmann has more than 15 years of international sales and account management experience from working in prominent companies like Toshiba and Nitto, where she has accumulated an impressive knowledge of the European semiconductor and electronics market. 

“We are excited to welcome Regine to ERS.” says CSMO and CEO Laurent Giai-Miniet,
“As we aim to increase our Channels-to-market, we found it necessary to hire someone who can optimize our offer and services to expand our distribution network. We believe Regine, with her vast experience and understanding of the market, will play a key role.”
“I am thrilled to join such a well-established and dynamic company. ERS is at the forefront of thermal test innovation and delivers high-quality products to big market players globally, and I look forward to support and extend our international customer base” says Regine Beckmann. 


Press contact:
Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776


NCAP Yole

ERS’ CTO will share his 10+ years of experience in Thermal debonding at the Advanced Packaging & System Integration Technology Symposium in Wuxi, China

WUXI, JUNE 19th, 2018 – Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP.

“I’m very excited about the opportunity to present at the Yole and NCAP Symposium and share my experience in FOWLP debonding and warpage adjust. I also look forward to meeting my industry peers” says Mr. Reitinger. “The market for small/mid density FOWLP is booming, and ERS’ advanced solutions for the eWLB remain state-of-the-art. Millions of eWLB wafers were already processed on ERS machines, representing billions of ICs.”

This marks the fourth year that the popular symposium, powered by Yole Développement (Yole) and hosted by NCAP China, will be held.

“Yole is pleased to welcome Klemens Reitinger as a speaker at its Advanced Packaging and System Integration Technology Symposium, in the FOWLP session”, states Thibault Buisson, General Manager at Yole. “In such a dynamic ecosystem and with the impressive FOWLP adoption by the semiconductor industry, Yole and its partner NCAP China offer an invaluable Symposium for all leaders in this industry. ERS Electronic, in addition to other speakers, will share their vision of the market, the technology trends and business opportunities. Yole and NCAP China are delighted to welcome such significant speakers for this 4th edition, and are sure that the attendees will appreciate the numerous and varied presentations and networking sessions”.

ERS electronic’s presentation will take place on Thursday from 9:25am to 9:50am at Hotel Nikko in Wuxi, China.


About the Advanced Packaging & System Integration Technology Symposium (June 20&21, 2018 – Wuxi, China)

After the three last successful events, Yole Développement (Yole) & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time. The advanced packaging is on the move. Emerging application are bringing new challenges, and packaging experts from all over the world will come to exchange on their vision and future perspectives. Don’t miss it!

During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference. 

Press contact:
Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776


ERS announces that its industry-leading AirCool® PRIME Thermal Chuck technology will soon be available for 200 mm wafer testing

Munich/Shanghai, March 13, 2018 – ERS electronic GmbH, the industry leader in
the market of thermal test solutions for semiconductor production, is today announcing
that its AirCool®PRIME thermal chucks will soon be available in 200 mm format.
AirCool®PRIME, which saves engineers 60% of soak time in wafer testing, was launched
four months ago in 300 mm format and has already been adopted by several global semiconductor vendors. ERS will now launch the smaller scale 200mm wafer chuck
format to meet growing customer demand.

ERS’s cutting-edge thermal management chuck technology enables top-notch performance
and unique features, including the lowest soaking times within the test cycle, ultra-low noise capability in the single-digit Femto-Ampere (fA) range and, with the help of the PRIME
Thermo Shield (PTS), a significant reduction in thermal transition time.
As with the 300 mm version, the new 200mm chuck can also be configured for different temperatures ranging from -65°C to up to 300°C using the ERS Electronic’s industry
recognized chiller. In addition, the system can now go as low as low as -10°C without a chiller
and as low as -40°C with the new compact chiller. The compact chiller is 1/3 the size of
standard chillers and is optimized for lower power consumption with improved capabilities
that create significant advances for users.
“We’re really excited to be able to offer our customers AirCool®PRIME technology in 200mm wafer format”, said Laurent Giai-Miniet, Chief Sales & Marketing Officer, ERS Electronic. “The market responded so well to our 300mm AirCool®PRIME product that we have accelerated the availability of the technology for 200 mm wafers, which are still widely used in the RF and automotive industries. The wafer probing market is growing and the 200mm wafer remains very important for our customers”.
ERS will begin shipping 200mm chuck AirCool©PRIME in Q4 2018 for immediate integration mainly into the MPI Corporation TS2000-SE probe stations.
“Co-developing the Air Cool PRIME technology with ERS Electronic has enabled significant
advancements beyond the above mentioned features such as a 40% reduction in transition
times, almost 50% less clean dry air (CDA) consumption, maintaining unique thermal range flexibility and field upgradability.” says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Test Division. “We have been very successful with the 300 mm AirCool®PRIME based systems and are delighted to offer this technology in our 200 mm platforms later this year. All of these new and unique features facilitate ease of use and significant reductions in the customer’s overall cost of test.”

Press contact:
Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776


ERS appoints Joshua Zhou as Sales and Marketing director in China

Munich/Shanghai, March 8, 2018 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, announced today that it has appointed Joshua Zhou as Sales and Marketing Director, China. He will be based in Shanghai and will focus on growing ERS' business in China.


Zhou is certainly qualified for the position, as he has more than ten years of experience from Sales and Marketing, and has garnered extensive knowledge of the semiconductor market from his 20 years in the industry. He has held the position as Vice President in two different IC design companies, and has had various roles in Research and Development, Product Engineering and Business Development.


I’m very pleased to be joining ERS, as it is a company with innovation and quality at its core. I expect to learn a lot from working with dedicated technical experts in thermal chuck solutions, and I can’t wait to be a part of ERS’ success journey in China.” says Joshua Zhou.
We are delighted to welcome Joshua Zhou to our ERS family, and we believe that his insight and experience from the Chinese semiconductor industry will be crucial in our endeavour to increase our presence in China” says Laurent Giai-Miniet. 


Zhou has a Bachelor degree in Engineering from Huazhong University of Science and Technology, and a Master’s degree in Electronics Engineering from Tsinghua University.

Press contact:
Sophia Oldeide
PR and MarCom
oldeide@ers-gmbh.de
+47 47332776


ERS electronic is exhibiting at SEMICON China for the first time

Munich, February 28, 2018 – ERS electronic GmbH will be exhibiting at SEMICON China with its own booth for the first time in its long history as a supplier of industry-leading thermal test solutions to the semiconductor industry.
With the goal of enhancing its support to its customer base in China, ERS is announcing that it is currently looking for service and support engineers to work exclusively with customers in China, operating from the city of Chengdu. 


“We are a company that is well known for its highly customisable solutions, and our aim is to always put the customer first. As we are seeing a rise in demand for our thermal management solutions in China, we are committed to employing a team of skilled engineers to serve this market specifically.” says Laurent Giai-Miniet CSMO and General Manager of ERS electronic GmbH.

Press contact:
Sophia Oldeide
PR and MarCom
oldeide@ers-gmbh.de
+47 47332776 


CSR article - Reducing wafer test time

CSR logo

Our CEO Klemens Reitinger has contributed to the Jan/Feb issue of Chip Scale Review magazine with an article discussing the importance of reducing wafer test time.

"This article will explain why it is so important to generate new solutions that reduce the expensive waiting time in the overall test process, and how ERS' new thermal wafer test chuck system is designed to improve this longstanding issue."

Click the pdf link above to read more!



ERS introduces cutting-edge innovation in semiconductor thermal testing

Munich, November 14, 2017 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness.


The new AirCool PRIME family of thermal chucks, developed in close cooperation with MPI
Corporation, offers unsurpassed flexibility and the industry’s fastest transition times. With this
achievement, the system greatly increases the customer’s test throughput. Likewise, the system
features the largest variety of thermal ranges on the market, offering the unmatched flexibility over
a wide range of semiconductor test applications. Available initially for 300mm (12”) wafers, the ERS AirCool PRIME incorporates a flexible and modular top plate design concept allowing easy field upgradeability. 


Through the integration of the PRIME™ Thermo Shield (PTS) into the chuck, the AirCool PRIME products drastically shorten the soaking times within the test cycle. Thus, the system achieves Instantly-Ready-For-Test IRFT capability. It creates a mini-environment around the chuck which results in fast and accurate tests. Its ultra-low signal noise in the single-digit Femto-Ampere (fA) range allows extreme sensitive measurement.In order to tailor the system’s thermal capability to the customer’s requirements and budget, the system can be configured for a variety of temperature ranges between -60°C and +300°C. Through ERS’ Super Booster technology, test temperatures down to -10°C can be achieved without a separate chiller. For lower test temperatures, down to -40°C, ERS is offering a compact chiller which occupies only one third of the footprint of comparable systems.

“Co-developing the Air Cool PRIME technology with ERS Electronic has enabled significant
advancements in feature sets that enable mutual customers to become much more effective and
efficient in thermal wafer probing applications,” says Stojan Kanev, General Manager of MPI
Corporation’s Advanced Semiconductor Division. “Combining the talent of our organizations has
once again proven highly successful in terms of providing powerful, customer oriented solutions.
Reductions in equipment footprint size and significantly reduced CDA consumption are two critical
cost savings the AirCool PRIME Technology provides yet it is the optimized thermal management,
quick set-up, distinguished electrical performance and enhanced throughput that are absolute game
changers.”


“We were very pleased with the cooperation with MPI which has given us valuable insights and
expertise in the challenging analytical wafer probing market” comments Klemens Reitinger, CEO of
ERS electronic GmbH. “Today's semiconductor market with megatrends like IoT, electromobility and
renewable energies, places extreme requirements on chips in terms of high-frequency and high
voltage technology. It is precisely the customers focusing on these application fields that will benefit
most from our new innovations. For example, AirCool PRIME enables fast and thorough testing of
power semiconductors for voltages up to 12kV”, explains Reitinger. “MPI´s experience in the highly
challenging RF Probing helped us include innovative features for testing High Speed and RF circuits
for the IoT market”, he adds.


Press contact:
Sophia Oldeide
PR and MarCom
oldeide@ers-gmbh.de
+47 47332776


ERS electronic will showcase manufacturing innovation at Semicon Europa

Munich, 2nd November, 2017 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world's leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous European customers, this represents an excellent opportunity to receive an update on the company’s innovation in terms of products and technology.

ERS has a solid and growing installed base among Europe’s highly advanced semiconductor manufacturers and research institutions. While today more than 50 per cent of ERS shipments are made to customers in Asia, Europe and its semiconductor industry remain essential for innovation and product development. ERS runs a support centre in Europe’s semiconductor manufacturing stronghold, Dresden. In addition, the company has established an eWLB (advanced Wafer Level Packaging) competence centre in Munich to address the fast growing FOWLP (Fan Out Wafer Level Packaging) markets in the semiconductor value chain backend. Through these activities, ERS maintains a close working relationship with its customers, including multiple key players in semiconductor testing. “The trust that our customers place in us gives us great momentum in the market. Our presence at the Semicon Europa will give us the opportunity to engage with our customers, share first-hand information about our new products and developments and give them a chance to discuss their needs with us”, says Laurent Giai-Miniet, CSMO of ERS electronic GmbH.

Yole Développement (Yole) confirms the impressive penetration of FOWLP in the advanced packaging industry: “Driven by numerous added values, including good electrical performance, high integration capability and small form factor for limited cost, the market doubled between 2015 and 2017 with Apple choosing TSMC’s FOWLP for their application processor”, explains Jérôme Azémar, Activity Developer, Advanced Packaging & Semiconductor Manufacturing at Yole. “This trend will keep going with a 20% CAGR(1)  from 2017 to 2022, thanks to other major players adopting FOWLP, explains the strategy consulting & market research company(2).”

At Semicon Europa, ERS will once again be demonstrating its innovation strength. “We will be releasing a complete new family of chucks, developed in cooperation with an industry leader”, explains Laurent Giai-Miniet. “This is the 4th generation of innovation in thermal chucks”.
“In the long run, we expect that our FOWLP activity will be as big as our thermal chuck business” Giai-Miniet adds.

Cost efficiency and accuracy in testing

All sub-markets and applications of semiconductor technology are characterized by rapid technological progress. Each new generation of chips features smaller geometries, higher operating frequencies and lower energy consumption. This progress can only be achieved if the semiconductors are subjected to ever more rigorous tests during the course of their production. These tests in turn enable an increased level of accuracy, repeatability, flexibility and cost-effectiveness for the test procedures. The test equipment from ERS electronic meets these requirements thanks to the outstanding expertise of its developers and their proverbial quality awareness. ERS’ development and production of AirCool systems takes place exclusively in Germany. The level of quality, together with the advanced design of ERS products, has allowed ERS to gain market share. In 2016 and 2017 alone, revenue generated from thermal chucks increased 33 per cent.


Press contact:

Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776

(1) CAGR : Compound Annual Growth Rate
(2) Source : Fan-Out: Technologies and Market trends report, Yole Développement, 2017
https://www.i-micronews.com/advanced-packaging-report/product/fan-out-technologies-and-market-trends-2017.html


 
 

Further news

  • 18.07.2017: ERS appoints seasoned expert to fill new CSMO position

    Industry Exhibitions and Conferences

    ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.

     

     
    • Meet us in San Diego!

      June 3 - June 6, 2018
      Rancho Bernardo Inn, San Diego, California
      Tent - #26

      More information
      Meet us in San Diego!
    • Meet us in San Diego!

      June 3 - June 6, 2018
      Rancho Bernardo Inn, San Diego, California
      Tent - #26

      More information
      Meet us in San Diego!
    • Meet us in San Francisco!

      July 10 - July 12, 2018
      Moscone Center - San Francisco, CA

      More information
      Meet us in San Francisco!
 
 

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