Temporary bonding and debonding processes are vital in semiconductor packaging for both wafer thinning and fan-out technologies. They enable the manipulation of thin wafers during fabrication, ensuring structural integrity and facilitating advanced packaging techniques.

Temporary bonding supports the handling of ultra-thin wafers during thinning processes, while also holding redistributed chips in place during fan-out packaging. In addition to facilitating the handling and manipulation of thin wafers, wafer debonding is particularly critical as it allows for the separation of the carrier substrate from the thinned wafer or redistributed chips, enabling the finalization of the packaging process. This step is essential for achieving the desired package thickness, ensuring optimal electrical performance, and enabling further downstream processing steps such as redistribution layer formation and solder ball attachment.  

ERS’s PhotoThermal debonding process allows stress-free debonding of temporary bonded wafers from a carrier. Stress-free debonding is made possible with a unique process and carrier combination approach. The energy is delivered by a flash lamp with the light absorbed by a light absorbing layer (LAL) in the carrier which converts light energy to thermal. This eliminates the adhesive material attached to the LAL and debonds the wafer safely. These processes enhance yield, throughput, and flexibility in packaging design, ultimately driving innovation in the semiconductor industry.