Request for Quote Bitte aktiviere JavaScript in deinem Browser, um dieses Formular fertigzustellen.Bitte aktiviere JavaScript in deinem Browser, um dieses Formular fertigzustellen.Name *VornameNachnameEmail *Company *Phone *Country *Install siteType of Technology* *Fan-out Chip First (eWLB/M-Series)Fan-out RDL FirstTemporary Bonding & Debonding (TBDB)Still undefinedN/AType of Product* *Thermal debondingPhotoThermal debondingWarpage adjustmentWarpage metrologyAutomatic or Semi-automatic? *AutomaticSemi-automaticSize *Wafer 150 mmWafer 200 mmWafer 300 mmPanel smaller than 500x500Panel larger than 500x500Other (please specify below)Type of Wafer/Panel *Molded wafer/panelSiliconSilicon Carbide (SiC)Gallium Nitride (GaN)Gallium Arsenide (GaAs)Other (please specify below)Additional requirements ERS Privacy Policy *I agree I have read and agree to the ERS Privacy Policy. By checking this box, you consent that the personal data you are providing will be processed for the purposes described in the Privacy Notice above.Custom Captcha * = Send
